Thermal Profiling for Large Bread & Bun Oven Systems

Thermal profiling of your large Bread & Bun oven systems with smart sensors from Reading Thermal can help you make adjustments to produce superior products. We take the guesswork out of oven control and provide bakeries with added safety and quality control measures.

Reading Thermal, a Reading Bakery Systems brand headquartered in Sinking Spring, Pennsylvania, has been focused on measuring and understanding the commercial baking process for more than 25 years. We manufacture and support the SCORPION® 2 Profiling System which has become a standard in the baking industry.

The SCORPION® 2 enables you to monitor actual in-process conditions and get the critical information you need to correct problems and maintain optimum process control.  This powerful diagnostic tool is valued by commercial bakeries around the world for understanding and improving bakery proofing, baking, cooling and freezing processes.

Bread & Bun Profiling Solutions

When profiling large Bread & Bun ovens like BakeTech, AMF and Turkington, there are some challenges regarding the placement of the SCORPION® 2 Equipment in the oven.

Unlike biscuit and cracker tunnel ovens where the SCORPION® 2 simply rides on the conveyor, bread & bun ovens require a specialized carrier. Placement is critical in order to produce accurate and repeatable data collection.

Additionally, long bake times and the need to produce the Bake Cycle S-Curve have led Reading Thermal to design a set of solutions just for the Bread & Bun baker:

Temp+Airflow Sensor Array

The Temp+Airflow Sensor Array is designed to simultaneously profile temperature and airflow across the width of large tray and grid conveyor ovens. The sensor array contains nine Temp+Airflow sensors spaced evenly across the length of an aluminum bar. The array comes in three sizes to match the most popular bread oven conveyor widths.

Pan+Dough Probe

Reading Thermal’s Pan+Dough Probe consists of a copper plate that is put into the pan and remains fixed at the same single point during its entire passage through the oven. It simultaneously captures the pan/dough interface temperature and the dough core temperature. The Pan+Dough Probe provides accurate repeatable results unattainable with hand-placed thermocouples. It connects to the Temperature Interface device which can accommodate five dual probes.

Bake Cycle S-Curve Analysis

Bakers rely on the Bake Cycle S-Curve Analysis to optimize the baking profile. This analysis provides the critical insight needed to make adjustments to ingredients, bake time, and zone temperature settings. SCORPION® Software Version 8 (SV8) automatically calculates the three key S-Curve data points: Yeast Kill, Gelatinization and Arrival.

If you are interested in thermal profiling for your large Bread & Bun oven systems, look no further than the state-of-the-art Reading Thermal SCORPION® 2 Profiling System and our various sensors and sensor arrays. Call our headquarters in Sinking Spring, Pennsylvania at (610) 678-5890 Ext. 2, or contact us online to learn more about our innovative products.