Thermal Profiling in the Baking Process to Improve Yield & Throughput

What is the best method for improving yield and throughput in your baking process? Consider thermal profiling systems from Reading Thermal that identify issues in commercial ovens and will help you resolve them.

At Reading Thermal, our heat transfer experts have investigated and measured the commercial baking process for more than 25 years. We manufacture and support the SCORPION® 2 Profiling System that measures and maps key baking parameters and has become a standard in the baking industry.

Tunnel Oven Profiling

The SCORPION® 2 Temperature Sensor Array measures temperature at product level in fixed positions across the conveyor and delivers a true representation of what your product is experiencing over time.

Measure convective and radiant heat fluxes at product level with the SCORPION® 2 Heat Flux Sensor, and see the results in Btu/hr·ft2 or W/m2.

Measure and record air flow with the SCORPION® 2 Air Velocity Sensor and get a precise picture of airflow patterns inside the oven.

Measure the moisture content of the thermal environment in both heating and cooling processes with the SCORPION® 2 Digital Humidity Sensor.. It is applicable to proofers, ovens, dryers and cooling tunnels.

These sensors and sensor arrays are connected to the SCORPION® 2 Profiling System and Data Logger and travel through the oven with the product, yielding a precise profile of the various conditions inside the oven.

Bread & Bun Oven Profiling

SCORPION® 2 requires a specialized carrier for bread and bun ovens. To produce accurate and repeatable data collection, placement is critical. Long bake times and the need to produce the Bake Cycle S-Curve led Reading Thermal to design solutions just for the bread and bun baker:

Temp+Airflow Sensor Array: Consisting of nine Temp+Airflow sensors that are evenly spaced across the length of an aluminum bar, this array is available in three sizes to match the most popular bread oven conveyor widths. It simultaneously profiles temperature and airflow across the width of large tray and grid conveyor ovens.

Pan+Dough Probe: This probe consists of a copper plate that is placed in the pan and remains fixed at the same single point as it travels through the oven. It captures the pan/dough interface temperature and the dough core temperature simultaneously, providing accurate repeatable results that are not achievable with hand-placed thermocouples.

Bake Cycle S-Curve Analysis: The Bake Cycle S-Curve Analysis optimizes the baking profile and provides the critical insight needed to make adjustments to ingredients, bake time, and zone temperature settings. SCORPION® Software Version 8 (SV8) automatically calculates the three key S-Curve data points: Yeast Kill, Gelatinization, and Arrival.

Start optimizing conditions during your baking process by using thermal profiling equipment from Reading Thermal to improve yield and throughput. Contact us online, or call our headquarters in Sinking Spring, Pennsylvania at (610) 678-5890 Ext. 2 to learn more about the innovative SCORPION® 2 Profiling System.