The SCORPION® 2 Profiling System and Data Logger from Reading Thermal enables you to achieve thermal profile optimization of your industrial oven by measuring, capturing, and storing data, such as temperature, air velocity, heat flux and humidity.
The heat transfer experts at Reading Thermal, headquartered in Sinking Spring, Pennsylvania, have been studying, measuring, and understanding the commercial baking process for over 25 years. We manufacture and support the SCORPION® 2 Profiling System which is a standard in the baking industry.
Monitoring and Profiling of Tunnel Ovens
The SCORPION® 2 Temperature Sensor Array measures temperature at product level, in fixed positions across the conveyor, and delivers a true representation of what your product is experiencing over time.
Measure convective and radiant heat fluxes at product level with the SCORPION® 2 Heat Flux Sensor, and see the results in Btu/hr·ft2 or W/m2.
Measure and record air flow with the SCORPION® 2 Air Velocity Sensor and get a precise picture of airflow patterns inside the oven.
Measure the moisture content of the thermal environment in both heating and cooling processes with the SCORPION® 2 Digital Humidity Sensor.. It is applicable to proofers, ovens, dryers and cooling tunnels.
These sensors and sensor arrays are connected to the SCORPION® 2 Profiling System and Data Logger and then travel through the oven with the product, yielding a precise profile of the various conditions inside the oven.
Monitoring and Profiling of Bread & Bun Ovens
Unlike biscuit and cracker tunnel ovens where the SCORPION® 2 can ride on the conveyor, bread and bun ovens require a specialized carrier. Placement is critical in order to produce accurate and repeatable data collection. In addition, long bake times and the need to produce the Bake Cycle S-Curve led Reading Thermal to design a set of solutions just for the bread and bun baker:
Temp+Airflow Sensor Array: This sensor array simultaneously profiles temperature and airflow across the width of large tray and grid conveyor ovens. It consists of nine Temp+Airflow sensors that are spaced evenly across the length of an aluminum bar. The array is available in three sizes to match the most popular bread oven conveyor widths.
Pan+Dough Probe: This probe consists of a copper plate that is placed in the pan and remains fixed at the same single point as it travels through the oven. It simultaneously captures the pan/dough interface temperature and the dough core temperature. The Pan+Dough Probe provides accurate repeatable results unattainable with hand-placed thermocouples. It connects to the Temperature Interface device which can accommodate five dual probes.
Bake Cycle S-Curve Analysis: The Bake Cycle S-Curve Analysis optimizes the baking profile and provides the critical insight needed to make adjustments to ingredients, bake time, and zone temperature settings. SCORPION® Software Version 8 (SV8) automatically calculates the three key S-Curve data points: Yeast Kill, Gelatinization and Arrival.
To bake your products to perfection, you must know what is happening inside your industrial oven. With thermal profile optimization systems from Reading Thermal, you will gain information you can use to make reliable data-based decisions about your processes and products. Contact us online, or call (610) 678-5890 Ext. 2 to explore our line of innovative products.