Bread baking process improvement can be achieved through thermal profiling, and the Reading Thermal Scorpion® 2 Profiling System and Data Logger can provide you with the critical information you need to correct problems and maintain optimum process conditions.
Reading Thermal, a Reading Bakery Systems brand headquartered in Sinking Spring, Pennsylvania, has researched and examined commercial baking processes since 1999. As a result, our team of heat transfer experts developed the SCORPION® 2 Profiling System, now an industry standard, which measures and maps the essential baking parameters of temperature, air velocity, heat flux, and humidity.
Our State-of-the-Art Systems
When you manufacture bread, buns, artisan bread, hamburger buns, rolls, cakes, biscuits, or other bread products, you know that several stages are temperature-dependent, including oven-spring, drying/dehydration, and color formation. However, large bread and bun ovens like BakeTech, AMF, and Turkington present some challenges with regard to the placement of the SCORPION® 2 Equipment in the oven.
Unlike biscuit and cracker tunnel ovens where the SCORPION® 2 can simply ride on the conveyor, bread and bun ovens require a specialized carrier. Placement is critical in order to produce accurate and repeatable data collection.
Specialized carriers are available for SCORPION® 2 Equipment to provide easy loading and unloading on endless conveyor ovens and tray and grid conveyor ovens.
Also, long bake times and the need to produce the Bake Cycle S-Curve have led Reading Thermal to design a set of solutions just for bread and bun bakers:
Temp+Airflow Sensor Array – The Temp+Airflow Sensor Array simultaneously profiles temperature and airflow across the width of large tray and grid conveyor ovens. The sensor array contains nine Temp+Airflow sensors spaced evenly across the length of an aluminum bar. The array comes in three sizes to match the most popular bread oven conveyor widths.
Pan+Dough Probe™ – Reading Thermal’s Pan+Dough Probe™ is a dual probe unit that is placed under the bread or bun dough and simultaneously captures the pan/dough interface temperature and the dough core temperature.
A copper spade is pressed against the pan by the weight of the dough and measures the critical pan/dough interface temperature. A vertical stainless steel probe penetrates the dough, to a fixed distance from the pan, measuring the dough core temperature used to produce the Bake Cycle S-Curve.
The Pan+Dough Probe™ provides accurate, repeatable results that are impossible to attain with hand-placed thermocouples. It connects to the Temperature Interface device that can accommodate five dual probes.
Bake Cycle S-Curve Analysis – Bakeries around the world depend on the Bake Cycle S-Curve Analysis to optimize their baking profiles. The analysis provides the critical insight they need to adjust ingredients, zone temperature settings, and bake time. SCORPION® Software Version 8 (SV8) will automatically calculate the three key S-Curve data points – yeast kill, gelatinization, and arrival.
Reading Thermal can help with bread baking process improvement through thermal profiling and ensure that you have the critical information you need to correct problems and maintain optimum conditions. Call us at (610) 678-5890 Ext. 2, or contact us online to learn more about our state-of-the-art products.